Laser Bond Inspection

LSP Technolgies is pioneering the field of using high energy lasers to non-destructively inspect adhesive bonds in composite and other bonded materials for weak or “kissing” bonds. The use of controlled, localized stress waves in materials and bonded joints offers new opportunities for the characterization of structures.  Bonded joints in particular benefit from this application because there is no nondestructive inspection method to measure bond strength.  LSP Technologies’ Laser Bond Inspection uses a high peak power short pulse laser to perform a localized proof test of a bond. The method can be nondestructively applied to strong bonds but will fail a weak bond, creating an internal disbond that is detectable by the laser bond inspection system itself or by post test ultrasonic inspection. To date numerous tests have shown the method to be sensitive to weak bonds in carbon fiber reinforced polymer composites structure bonds created by poor adhesive mixing, improper surface preparation or contamination. To Learn More  click on the link. Flash http://mediazone.brighttalk.com/comm/ReedElsevier/33bdd84a70-22762-2251-24177 Windows Media http://mediazone.brighttalk.com/comm/ReedElsevier/b3a9cda1c2-22762-2250-24176