Innovative Leaders in Laser Technologies
Patents for Laser Peening and Laser Bond Inspection
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Develop New Intellectual Property
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Pioneering development of laser peening and related technologies
LSP Technologies has a rich history of innovation in the field of pulsed-laser material processing for longer-lasting parts. Our extensive intellectual property portfolio reflects not only our commitment to research, but also how we connect laser technologies to commercial industry. The tradition of adaptation and idea creation now spans a quarter century. New products and services continue to the marketplace, with the development of both new laser peening equipment and novel custom solutions for industry.
Laser Peening Patents
1. Laser peening process and apparatus using a liquid erosion-resistant opaque overlay coating
The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
Inventors: Tenaglia; Richard D. (Columbus, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 12/013,024 Filed: January 11, 2008
2. Bend bar quality control method for laser shock peening
A bend bar is available for use in a quality control test for testing for a consistency of residual stress effects in a particular material using a given a laser peening process. The bar is composed of the particular material to be tested and has a bar length and a bar thickness. The particular material has a characteristic maximum stress penetration depth for compressive residual stresses that can be formed in using the given laser peening process. The bar thickness is chosen so as to be at least twice the characteristic maximum stress penetration depth. The bar has a test surface that extends parallel to the bar length and perpendicular to the bar thickness. After forming a spot pattern on the test surface using the given laser peening process, the deflection generated in the bar due to the compressive residual stresses induced by laser peening can then be measured and used as a quality control measurement.
Inventors: Tenaglia; Richard D. (Columbus, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH), Toller; Steve (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/009,123 Filed: December 10, 2004
3. Laser peening process and apparatus using a liquid erosion-resistant opaque overlay coating
The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
Inventors: Tenaglia; Richard D. (Columbus, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/843,363 Filed: August 22, 2007
4. Method of modifying a workpiece following laser shock processing
A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
Inventors: Dulaney; Jeff L. (Delaware, OH), Toller; Steven M. (Dublin, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 12/201,519 Filed: August 29, 2008
5. Method of modifying a workpiece following laser shock processing
A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
Inventors: Toller; Steven M. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Delaware, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/023,228 Filed: December 27, 2004
6. Laser peening process and apparatus
The invention relates to a method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a water based coating to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shock wave. A high speed jet of fluid is directed to coated portion of the solid material at times to remove the coating from the solid material. Additionally, the method may include directing a high speed jet of fluid to the surface of the solid material to dry the solid material.
Inventors: Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/547,012 Filed: October 23, 1995
7. Laser peening of dovetail slots by fiber optical and articulate arm beam delivery
A laser peening apparatus is available for laser peening a hidden surface of a workpiece, the hidden surface not being line-of-sight accessible to laser energy for treatment thereof. The apparatus includes a pulsed laser system and a laser directing unit. The pulsed laser system is configured for generating the laser energy used for laser peening. The laser directing unit operatively receives and channels the laser energy generated by the pulsed laser system. The laser directing unit includes a laser transmission end and is capable of variably and selectively positioning that laser transmission end. The laser directing unit is thereby configured for variably and selectively directing laser energy upon the hidden surface via the laser transmission end.
Inventors: Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Delaware, OH), Lahrman; David F. (Powell, OH) Filed: September 2, 2003
8. Laser peening process and apparatus using a liquid erosion-resistant opaque overlay coating
The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
Inventors: Tenaglia; Richard D. (Columbus, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/654,369 Filed: September 2, 2003
9. Method using laser shock processing to provide improved residual stress profile characteristics
Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.
Inventors: Clauer; Allan H. (Worthington, OH), Lahrman; David F. (Powell, OH), Dulaney; Jeff L. (Delaware, OH), Toller; Steven M. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/662,802 Filed: September 12, 2003
10. Automated positioning of mobile laser peening head
The present invention enables the processing head to locate itself precisely on the surface of the structure being processed, and to then reposition itself correctly for the next laser spot. Further, the present invention will complete processing a laser peened area, the area including a multiplicity of spots arranged in a specific pattern, and correctly laser peen each spot in the area under control of a controller including control linkages with the laser. The invention further provides an automated laser peening processing head encompassing spatial position sensing and locating means, as well as programmed spatial positioning, application of overlay materials, verification of proper overlay condition and positioning, and notification of the laser to pulse the surface of the structure.
Inventors: Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc (Dublin, OH) Appl. No.: 10/372,523 Filed: February 21, 2003
11. Method of modifying a workpiece following laser shock processing
A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
Inventors: Toller; Steven M. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies Inc. (Dublin, OH) Appl. No.: 09/590,866 Filed: June 9, 2000
12. Overlay control for laser peening
A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.
Inventors: Dykes; Steven E. (Powell, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH), O’Loughlin; Mark (Galloway, OH) Assignee: LSP Technologies Inc. (Dublin, OH) Appl. No.: 10/372,526 Filed: February 21, 2003
13. System for laser shock processing objects to produce enhanced stress distribution profiles
Various laser shock processing systems are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One system is configured to simultaneously irradiate a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Another system irradiates opposite sides of the workpiece at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Another system simultaneously irradiates opposite sides of the workpiece using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Another system simultaneously irradiates opposite sides of the workpiece to form a set of laterally offset laser shock peened surfaces.
Inventors: Clauer; Allan H. (Worthington, OH), Lahrman; David F. (Powell, OH), Dulaney; Jeff L. (Dublin, OH), Toller; Steve M. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/207,527 Filed: July 29, 2002
14. Surface finishes on laser rods and slabs for laser peening systems
A laser gain medium and a method of manufacturing a laser medium, such as a laser rod, or slab for use in high-powered laser peening systems. A laser medium and method reduces stress risers along the surface of the amplifier medium by grit blasting, polishing, etching, annealing, and by eliminating platinum inclusions within the laser glass.
Inventors: Sokol; David (Dublin, OH), Dulaney; Jeff (Dublin, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/118,423 Filed: April 8, 2002
15. Articles having improved residual stress profile characteristics produced by laser shock peening
Articles produced by laser shock processing exhibit various compressive residual stress distribution profiles. A gas turbine engine airfoil includes an asymmetrical stress profile formed through the thickness of its thin section. The articles include plural laser shock peened surfaces and plural regions having deep compressive residual stresses imparted by laser shock peening extending into the article from the laser peened surfaces. One article includes at least one set of simultaneously formed, adjacent non-overlapping laser shock peened surfaces. Another article includes at least one set of opposing laser shock peened surfaces formed at different times at opposite sides of the article. Another article includes at least one set of opposing laser shock peened surfaces formed simultaneously at opposite sides of the article using laser beams having different pulse lengths. Another article includes at least one set of laterally offset laser shock peened surfaces simultaneously formed at opposite sides of the article.
Inventors: Clauer; Allan Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/846,494 Filed: April 30, 2001
16. UV curable overlays for laser peening
A method and apparatus for increasing the effectiveness and efficiency of laser shock processing of a solid material. The method includes applying an energy absorbing coating to a portion of the surface of a solid material, applying an ultraviolet curable resin to the coated portion of the surface of the solid material, applying an ultraviolet light to the curable resin to form a pellicle over the energy absorbing coating on the surface of the solid material, and applying a transparent overlay to the pellicular portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. After the pulse of coherent energy is directed to the solid material, a high-speed jet of fluid may be directed to the coated portion of the solid material to remove the remaining coating from the solid material.
Inventors: Tenaglia; Richard D. (Columbus, OH), Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/372,520 Filed: February 21, 2003
17. Image processing for laser shock processing
An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.
Inventors: Dulaney; Jeffrey L. (Dublin, OH), O’Loughlin; Mark E. (Galloway, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/846,494 Filed: April 30, 2001
18. Method using laser shock processing to provide improved residual stress profile characteristics
Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the midplane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.
Inventors: Clauer; Allan H. (Worthington, OH), Lahrman; David F. (Powell, OH), Dulaney; Jeff L. (Dublin, OH), Toller; Steve M. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/207,560 Filed: July 29, 2002
19. UV curable overlays for laser shock processing
The invention, in another form thereof, comprises a method of laser shock peening the surface of a solid material with or without the use of a transparent overlay material. An energy absorbing coating is applied to a portion of the surface of a solid material. An ultraviolet-curable resin coating is applied to the energy absorbing coating and the curable resin is exposed to an ultraviolet light and forms a pellicle over the energy absorbing coating. A pulse of coherent energy is directed to the energy absorbing coating of the solid material to create a shock wave.
Inventors: Tenaglia; Richard D. (Columbus, OH), Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/911,070 Filed: July 23, 2001
20. Hidden surface laser shock processing
A laser processing method for processing a hidden surface of a workpiece, the hidden surface being disposed within a recess having an opening. The method includes inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of a workpiece to create a shock wave. Alternatively a surface of the recess may be modified to laser shock process the hidden surface. In one particular embodiment, the reflective member is specifically shaped toprovide diction of a pulse of coherent energy to a hidden surface so that a substantially uniform energy density is applied to the hidden surface. In an additional embodiment, the method is optimized for preventing damage to the reflective member. In one particular embodiment, the reflective member is composed of a fluid.
Inventors: Dulaney; Jeffrey L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Dublin, OH), Walters; Craig T. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/307,117 Filed: May 7, 1999
21. Quality control plasma monitor for laser shock processing
A method and apparatus for quality control of laser shock processing. The method includes measuring emissions and characteristics of a workpiece when subjected to a pulse of coherent energy from a laser. These empirically measured emissions and characteristics of the workpiece are correlated to theoretical shock pressure, residual stress profile, or fatigue life of the workpiece. The apparatus may include a radiometer or acoustic detection device for measuring these characteristics.
Inventors: Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH), Epstein; Harold M. (Columbus, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeffrey L. (Dublin, OH), O’Loughlin; Mark (Galloway, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/896,267 Filed: June 29, 2001
22. Overlay control for laser peening
A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.
Inventors: Dykes; Steven E. (Powell, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH), O’Loughlin; Mark (Galloway, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/767,528 Filed: January 23, 2001
23. Shock pressure gauge for laser peening apparatus
An apparatus for measuring the strength of a pressure pulse created from a laser peening device. The apparatus is reusable, and includes a pressure-sensitive medium, a back-up disk, and a cap, all disposed within a housing having a removable lid. All components of the apparatus are replaceable, thereby allowing an operator to utilize the apparatus more than once despite the harsh environment of laser peening.
Inventors: Clauer; Allan H. (Worthington, OH), Walters; Craig T. (Powell, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/883,712 Filed: June 18, 2001
24. Beam path clearing for laser peening
An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
Inventors: Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Grove City, OH), Dulaney; Jeffrey L. (Dublin, OH)
Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/952,968 Filed: September 13, 2001 Filed: May 2, 2000
25. Quality control for laser peening
A method of testing the operation of a laser peening system includes providing a sensor in a possible laser beam path, applying a transparent overlay material to the sensor, directing a pulse of coherent energy to the sensor through the transparent overlay material to create a shock wave, and determining a characteristic of the created shock wave with the sensor.
Inventors: O’Loughlin; Mark E. (Galloway, OH), Clauer; Allan H. (Worthington, OH), Sokol; David W. (Dublin, OH), Dulaney; Jeffrey L. (Dublin, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/106,793 Filed: June 29, 1998
26. Multiple beam time sharing for a laser shock peening apparatus
A multiple laser peening cell apparatus for receiving pulses of energy from a laser shock peening device is comprised of a first cell for receiving a first pulse of energy, a second cell for receiving a second pulse of energy, and a beam distribution means, for directing the first pulse of energy and the second pulse of energy. Also, a method of directing pulses of energy originating from a single source to multiple workpieces comprises the steps of creating a first pulse of energy, directing the first pulse of energy to a first workpiece located in a first laser peening cell, creating a second pulse of energy, and directing the second pulse of energy to a second workpiece located in a second laser peening cell.
Inventors: Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/911,237 Filed: July 23, 2001
27. Mechanical gauges for quality assurance of laser peening
A method and apparatus for measuring the quality of a laser peening process, which includes a test element, a mount for the test element, wherein the test element is mounted at a preselected point in the anticipated path of a laser pulse, the laser pulse irradiates the test element, the deflection of the test element is measured in the direction substantially perpendicular and away from the impacted surface of the test element, and the deflection measurement is compared to a previously generated chart showing the relationship between characteristics of test elements and desired material properties.
Inventors: Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Dublin, OH), Dulaney; Jeff L. (Dublin, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/592,534 Filed: June 12, 2000
28. Method of positioning a workpiece for optimal processing
A method of producing a workpiece involves positioning the workpiece at a current processing position indicated by a hard-coded part program and then collecting position data which defines the positional arrangement of a current target area of the workpiece. The collected position data is processed by comparing it to reference position information that represents the positional arrangement of the same target area in an ideal workpiece employed in the development of the part program. The position of the workpiece (and hence the target area) is adjusted in accordance with the comparison results. A laser shock processing operation is performed on the workpiece at the current target area following the position adjustment step.
Inventors: O’Loughlin; Mark E. (Galloway, OH), Toller; Steven M. (Dublin, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, INC (Dublin, OH) Appl. No.: 09/564,360 Filed: May 2, 2000
29. Laser peening to provide design credit for improved fatigue properties
A method of determining and utilizing the improved properties of a solid material that has been subjected to laser shock processing includes the steps of determining a set of desired fatigue tolerances for a work piece, utilizing a known design credit based on enhanced fatigue tolerances due to laser shock processing, and subsequently determining a base material and set of tolerances that meet the set of desired fatigue tolerances for the work piece, with adjustments being made for design credit.
Inventors: Clauer; Allan (Worthington, OH), Dulaney; Jeff (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/443,812 Filed: November 19, 1999
30. Oblique angle laser shock processing
A method and apparatus for improving properties of a solid material by providing shockwaves therethrough. The method includes controlling the incident angle .THETA. of the laser beam applied to the workpiece so that the required residual stresses are created in the workpiece. Particular methods of control such as lenses, polarizers, and particular transparent overlay geometries are shown. The apparatus includes structure for controlling the position and incident angle of the laser beam then controlling the polarization and/or the shape of the incident impact area, based on such incident angle .THETA. or thickness of the workpiece.
Inventors: Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc (Dublin, OH) Appl. No.: 09/861,419 Filed: May 18, 2001
31. Utilizing altered vibration responses of workpieces, such as gas turbine engine blades
An apparatus and method of utilizing natural frequency shifts of a laser shock processed workpiece to determine if sufficient laser shock processing has been accomplished.
Inventors: Lahrman; David F. (Powell, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/448,683 Filed: November 23, 1999
32. Shock pressure gauge for laser peening apparatus
An apparatus for measuring the strength of a pressure pulse created from a laser peening device. The apparatus is reusable, and includes a pressure-sensitive medium, a back-up disk, and a cap, all disposed within a housing having a removable lid. All components of the apparatus are replaceable, thereby allowing an operator to utilize the apparatus more than once despite the harsh environment of laser peening.
Inventors: Clauer; Allan H. (Worthington, OH), Walters; Craig T. (Powell, OH), Lahrman; David F. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/443,811 Filed: November 19, 1999
35. Single mode oscillator for a laser peening laser
A technique for increasing the lifetime of optical components that are used in a laser for laser shock peening. The technique employs a properly sized iris or a gradient reflector within a laser oscillator to produce a single-transverse-mode laser beam. This technique eliminates hot spots that significantly reduce the lifetime of optical components. Utilization of the present invention can increase the lifetime of components by a factor of ten of their conventional lifetime.
Inventors: Dulaney; Jeff (Dublin, OH), Sokol; David (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/178,968 Filed: October 26, 1998
36. Beam path clearing for laser peening
An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
Inventors: Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Grove City, OH), Dulaney; Jeffrey L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/253,156 Filed: February 19, 1999
37. Image processing for laser peening
An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.
Inventors: Dulaney; Jeffrey L. (Dublin, OH), O’Loughlin; Mark E. (Galloway, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/057,107 Filed: April 8, 1998
38. Multiple beam time sharing for a laser shock peening apparatus
A multiple laser peening cell apparatus for receiving pulses of energy from a laser shock peening device is comprised of a first cell for receiving a first pulse of energy, a second cell for receiving a second pulse of energy, and a beam distribution means, for directing the first pulse of energy and the second pulse of energy. Also, a method of directing pulses of energy originating from a single source to multiple workpieces comprises the steps of creating a first pulse of energy, directing the first pulse of energy to a first workpiece located in a first laser peening cell, creating a second pulse of energy, and directing the second pulse of energy to a second workpiece located in a second laser peening cell.
Inventors: Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/421,428 Filed: October 19, 1999
45. Smart controller for laser peening
A laser shock processing apparatus with controller for controlling laser shock processing operation. The controller generates an operator perceivable alert when a processing value is not within a predetermined range of a preset value. The controller may adjust the processing value to be within the predetermined range or may deactivate a laser from directing a beam of coherent energy to a workpiece. In one embodiment, a plurality of controllers comprise distributed processing of various processing values for controlling laser shock processing operation.
Inventors: O Loughlin; Mark E. (Galloway, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/349,431 Filed: July 7, 1999
46. Efficient laser peening
A method of laser shock peening a workpiece including the steps of laser shock peening at least one surface of the workpiece so that it extends over an area of the workpiece and forms a region having compressive residual stresses imparted by the laser shock peening extending into the workpiece from the surface, and firing a laser beam to produce the laser shock peened surface with more than one row of laser beam spots, wherein adjacent laser beam spots and/or rows are one of touching or spaced apart from each other.
Inventors: Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/964,798 Filed: November 5, 1997
47. Process chamber for laser peening
An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator disposed therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.
Inventors: Toller; Steven M. (Grove City, OH), Dulaney; Jeffrey L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), O’Loughlin; Mark E. (Galloway, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/457,033 Filed: December 8, 1999
48. Laser peening hollow core gas turbine engine blades
A hollow workpiece includes an outside surface through which a port opens to the hollow interior, and a laser peened area on the surface of the workpiece. The laser peened area is created on the surface while the hollow interior is at least partially filled with a substance other than air. A method of laser peening a hollow core gas turbine engine blade includes the steps of providing a hollow core gas turbine engine blade, filling the hollow core with a substance other than air, and then, laser peening the hollow core gas turbine engine blade.
Inventors: Dulaney; Jeffrey L. (Dublin, OH), Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/000,776 Filed: December 30, 1997
49. Process chamber for laser peening
An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator located therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.
Inventors: Toller; Steven M. (Grove City, OH), Dulaney; Jeffrey L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), O’Loughlin; Mark E. (Galloway, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/000,777 Filed: December 30, 1997
50. Peening process with reduction of dielectric breakdown to increase peak pressure pulse
The present invention provides a method of laser shock processing that can be used in a production environment that increases the peak pressure of the shock wave applied to the workpiece that increases residual compresses stresses therein. Such improvement is created by a reduction of dielectric breakdown of the transparent overlay layer utilized. The method includes the steps of applying a transparent overlay such as water over the workpiece and reducing or limiting the thickness of the transparent overlay material. An alternate embodiment of the invention to reduce dielectric breakdown incorporates the use of a changing or circularly polarized laser beam as opposed to a linearly polarized laser beam.
Inventors: Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Sokol; David W. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/874,174 Filed: June 13, 1997
51. Laser peening process and apparatus with uniform pressure pulse confinement
A method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a transparent overlay to the solid material to be worked. The solid material or overlay is vibrated to release any gas bubbles or solid debris within the transparent layer which could cause localized non-uniform confinement of a pressure pulse applied for a workpiece thereby causing irregularities in the workpiece surface. A pulse of coherent laser energy is the directed to the coated portion of the solid material to create a shock wave. Additionally, the method may include adding a wetting agent or controlling the temperature of the overlay material to reduce the concentration of gas bubbles therein.
Inventors: Dulaney; Jeffrey L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/211,568 Filed: December 15, 1998
52. Hidden surface laser shock processing
The invention includes a laser processing method for processing a hidden surface of a workpiece, the hidden surface disposed within a recess having an opening. The method comprises inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface.
Inventors: Toller; Steven M. (Dublin, OH), Walters; Craig T. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/227,745 Filed: September 15, 2005
53. Altering vibration frequencies of workpieces, such as gas turbine engine blades
A method of modifying the vibration resonance characteristics of a workpiece includes the steps of determining a vibratory resonance condition frequency of the workpiece, determining the mode shape of said vibratory resonance condition, locating an area on the workpiece that includes a maximum curvature for the determined mode shape and vibratory resonance condition frequency; then laser shock peening the located area to create residual compressive stresses within the workpiece to shift the determined vibratory resonance condition frequency. A workpiece such as a gas turbine engine blade is also disclosed.
Inventors: Clauer; Allan H. (Worthington, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/926,622 Filed: September 9, 1997
54. Laser shock peening apparatus with a diffractive optic element
A laser peening apparatus, including a laser generator to generate a laser beam having a first cross-sectional shape; and a diffractive optic element. The diffractive optic element changes the laser beam to a second cross-sectional shape. The apparatus also includes demagnifying and magnifying lenses. The diffractive optic element may create a second cross-sectional shape such as rectangular, hexagonal, or even split the laser beam into multiple beams. The diffractive optic element may also create a second cross-sectional shape of the laser beam varying in intensity thereacross or varying in energy distribution.
Inventors: Dulaney; Jeff L. (Dublin, OH), Sokol; David W. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/927,717 Filed: September 11, 1997
55. Laser shock peening with tailored multiple laser beams
Method of changing the residual compressive stresses of an area of a workpiece by tailoring multiple laser beams applied to the workpiece. In one embodiment, a relatively long duration laser pulse is applied to the workpiece followed by a relatively short duration laser pulse. Other tailoring embodiments used to increase the total residual compressive stress of workpieces include blending two laser pulses, or splicing them utilizing a first short sliced-type beam combined with a relatively long duration, high powered gaussian laser beam pulse. A third embodiment utilizes two or more laser beams or pulses of different wavelengths.
Inventors: Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthington, OH), Sokol; David W. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/927,716 Filed: September 11, 1997
56. Oblique angle laser shock processing
A method and apparatus for improving properties of a solid material by providing shockwaves therethrough. The method includes controlling the incident angle .theta. of the laser beam applied to the workpiece so that the required residual stresses are created in the workpiece. Particular methods of control such as lenses, polarizers, and particular transparent overlay geometries are shown. The apparatus includes structure for controlling the position and incident angle of the laser beam then controlling the polarization and/or the shape of the incident impact area, based on such incident angle .theta..
Inventors: Dulaney; Jeff L. (Dublin, OH), Clauer; Allan H. (Worthinton, OH), Toller; Steven M. (Grove City, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 08/805,735 Filed: February 25, 1997
Laser Bond Inspection Patents
1. Methods for fabricating fiber-reinforced plastic test specimen assemblies having weak adhesive bonds
A method for repeatably fabricating a test specimen assembly comprising a pair of fiber-reinforced plastic (FRP) test specimens adhesively bonded together, the bonded joint having respective areas of substantially different, but consistent variable adhesive bond strengths suitable as a calibration standard. The method comprises fabricating a first FRP test specimen having a bonding surface with first and second areas that have substantially different bonded joint performance-governing characteristics and then using adhesive to bond the bonding surface of the first FRP test specimen to the bonding surface of a second FRP test specimen. The different bonded joint performance-governing characteristics are achieved by treating first and second areas of the surface of the first FRP test specimen using different respective surface preparation techniques.
Inventors: Bossi; Richard Henry (Renton, WA), Piehl; Marc J. (Renton, WA), Frisch; Douglas Allen (Renton, WA), Blohowiak; Kay Y. (Issaquah, WA), Grace; William B. (Seattle, WA), Van Voast; Peter J. (Seattle, WA) Assignee: The Boeing Company (Chicago, IL) Appl. No.: 12/908,032 Filed: October 20, 2010
2. Lamb waves for laser bond inspection
Exemplary embodiments are disclosed for the use of Lamb waves in laser bond inspection.
Inventors: Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH), Housen; Kevin R. (Tacoma, WA), Bossi; Richard H. (Renton, WA), Toller; Steven M. (Dublin, OH) Assignee: LSP Technologies (Dublin, OH) Appl. No.: 11/873,571 Filed: October 17, 2007
3. Apparatus and method for non-destructive testing
A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.
Inventors: Toller; Steven M. (Dublin, OH), Walters; Craig T. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/227,745 Filed: September 15, 2005
4. Laser induced bond delamination
Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
Inventors: Toller; Steven M. (Dublin, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 12/435,448 Filed: May 5, 2009
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5. Tape overlay for laser bond inspection
Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.
Inventors: Toller; Steven M. (Dublin, OH), Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/873,705 Filed: October 17, 2007
6. Laser system and method for non-destructive bond detection and evaluation
A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
Inventors: Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH), Dulaney; Jeff L. (Delaware, OH), Toller; Steven M. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/950,865 Filed: September 27, 2004
7. Laser bond inspection using annular laser beam
Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
Inventors: Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH), Toller; Steven M. (Dublin, OH), Bossi; Richard H. (Renton, WA), Housen; Kevin R. (Tacoma, WA)
Assignee: LSP Technologies, Inc. (Dublin, OH), The Boeing Company (Chicago, IL) Appl. No.: 12/396,081 Filed: March 2, 2009
8. Laser bond inspection using annular laser beam
Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
Inventors: Sokol; David W. (Dublin, OH), Walters; Craig T. (Powell, OH), Houson; Kevin R. (Tacoma, WA), Bossi; Richard H. (Renton, WA), Toller; Steven M. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) The Boeing Company (Chicago, IL) Appl. No.: 11/873,677 Filed: October 17, 2007
Other Patents in Laser Technology
1. Laser shock induced spallation
Laser shock methods and systems are disclosed for evaluating impact resistance of materials, and for simulating and evaluating threshold conditions where damage may occur.
Inventors: Tenaglia; Richard D. (Westerville, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 11/946,139 Filed: November 28, 2007
2. Method and system for neutralization of buried mines
A system for neutralizing a buried mine includes a laser that is configured to generate laser energy that communicates through the covering ground material and accesses the mine in a manner sufficient to neutralize the mine. Neutralization can occur by deflagration or detonation. The laser includes a solid-state lasing medium that is run substantially uncooled during the lasing run. Namely, the lasing medium is operated without cooling until the lasing medium reaches a temperature where thermal population in a lower laser level begins to significantly lower inversion density. Following completion of the lasing run, the lasing medium is cooled at a rate limited only by a thermal stress fracture level of the lasing medium. Operation of the laser in this manner permits the laser to deliver high-irradiance, high-repetition rate pulses according to a burst mode operation that successfully accomplishes neutralization in a desired time period. The burst mode also facilitates preferential selection of the mechanism of laser energy-material interaction to promote rapid penetration rates.
Inventors: Sokol; David W. (Dublin, OH), Dulaney; Jeff L. (Dublin, OH), Walters; Craig T. (Powell, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 10/386,644 Filed: March 12, 2003
3. Laser search peening for exfoliation corrosion detection
An exfoliation corrosion detection method which enables rapid detection and evaluation of hidden exfoliation corrosion on aircraft with related cost savings. Pressure exerted on the surface by the laser created plasma generates a pressure pulse or shock wave that propagates into the part. When the stress in the shock wave is above the dynamic elastic limit of the material, the surface material yields plastically. This plastic strain creates compressive residual stresses in the surface, thereby enabling detection of exfoliation corrosion, if present.
Inventors: Lahrman; David F. (Powell, OH), Clauer; Allan H. (Worthington, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/846,084 Filed: April 30, 2001
4. Device monitor for multiple optical signals
A monitor of a plurality of optical signals utilizing fiber optics which form an array. An image of the array is captured and the captured image is processed for detecting a quality of an optical signal such as the presence, absence, intensity, wavelength, or other quality of the optical signal. A method of monitoring a plurality of optical signals by capturing a plurality of optical signals from an array of signals and detecting a quality of at least one optical signal is also disclosed.
Inventors: O Loughlin; Mark E. (Galloway, OH), Walters; Craig T. (Powell, OH), Kenney; Patrick M. (Powell, OH), Toller; Steven M. (Dublin, OH), Dulaney; Jeff L. (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/353,674 Filed: July 15, 1999
5. Laser amplifier with variable and matched wavelength pumping
A laser amplifier for laser shock processing having a pump cavity supplying photons at selected or variable wavelengths and orientations to that of the gain medium present therein. In one embodiment, the pump wavelength is substantially equal to a corresponding wavelength difference between the upper laser state energy level and the ground state energy level of atoms composing the gain medium. In an alternate embodiment, photonic energy is applied asymmetrically to the gain medium to produce a desired spatial energy profile. The pump cavity may comprise an alexandrite laser or a diode laser system. Depending on the type of pump cavity, the photonic energy is applied to the gain medium either longitudinally or transverse to the laser beam axis of traversing therein.
Inventors: Sokol; David (Dublin, OH) Assignee: LSP Technologies, Inc. (Dublin, OH) Appl. No.: 09/305,526 Filed: May 5, 1999